GF Launches LiquidCore Engineered Flow Solution for Direct-to-Chip Liquid Cooling

Direct-to-chip cooling places strict demands on the fluid handling infrastructure. Consistent flow, coolant purity, and hydraulic stability are critical to maintaining chip temperatures and system uptime. LiquidCore addresses these needs by combining high-performance polymer pipes, fittings, valves, actuation, instrumentation, engineered manifolds, jointing solutions, and precision design and pre-fabrication into one integrated solution.

A complete engineered Flow Solution

• Distribution system: Pre-fabricated high-performance polymer liquid-to-rack piping system for reliable coolant distribution
• Rack integration: The patented Quick Connect Valve 700 has a 25% better flow rate, is more than 50% lighter than metal alternatives and enables safe and fast rack-integration.
• In-rack manifold: Custom-designed manifolds ensure consistent coolant distribution across every port to maintain thermal stability under high computational loads.
• Valve actuation and instrumentation: Valves, actuation, and measurement solutions support precise flow regulation and system efficiency.

GF’s global engineering and pre-fabrication services provide tailored 3D design, hydraulic and material reviews, reliable infrared jointing, and controlled-environment manufacturing to deliver ready-to-install modules. This combination reduces on-site labor, shortens installation times, and strengthens reliability for mission-critical cooling infrastructure. Weld bead inspection supports consistent joint integrity and long-term operational stability at the core.

Driving sustainability and efficiency 

LiquidCore builds on more than 30 years of experience in demanding fluid handling applications for the semiconductor industry. High-purity polymers have long been proven in corrosive and mission-critical environments and are ideal for handling deionized water and coolants such as PG25.

Compared with conventional metal systems, GF’s polymer Flow Solution offers: 

• 100% corrosion-free operation 
• Up to 80% lower CO₂ footprint* 
• 4× faster installation through pre-fabrication* 
• 30% better thermal insulation*
• Certified Environmental Product Declarations (EPD) and full traceability across manufacturing and installation help data center operators meet their ESG targets without compromising system performance. 

*compared to metal alternatives

“With LiquidCore, we combine our materials expertise and global design and pre-fabrication footprint to help scale AI computing efficiently and sustainably. By rounding out our polymer offering from chiller to chip, we enable fully integrated Flow Solutions for the entire data center cooling, environment with our novel solution for the data hall” said Charles Freda, Global Head Data Centers at GF Industry & Infrastructure Flow Solutions.